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Method for a compression-mount LGA substrate

IP.com Disclosure Number: IPCOM000021034D
Publication Date: 2003-Dec-17
Document File: 2 page(s) / 74K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a compression-mount land grid array (LGA) substrate. Benefits include improved reliability

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Method for a compression-mount LGA substrate

Disclosed is a method for a compression-mount land grid array (LGA) substrate. Benefits include improved reliability

Background

         A requirement exists to reduce LGA substrate warpage during the manufacturing process.

         Conventionally, a high engagement force is applied for substrate/socket actuation. The LGA socket is mounted on a motherboard. An LGA substrate with a die is mounted on top of the LGA socket. Separate thermal solution and retention schema are used to mechanically keep all components together. Typically, socket terminals with the same spring constant are utilized (see Figure 1).

General description

         The disclosed method is an LGA substrate with variable spring constant terminals (contacts) for an LGA socket assembly.

         The key elements of the method include:

•         Land Grid Array substrate

•         Land Grid Array socket

•         Variable spring constant terminals (contacts)

Advantages

         The disclosed method provides advantages, including:

•         Improved reliability due to improving socket/substrate durability

•         Improved reliability due to reducing the force required to actuate the package

•         Improved ergonomics due to reducing the force required to actuate the package

•         Improved cost effectiveness due to reducing the bulk and robustness of the socket actuation mechanism

Detailed description

         The disclosed method includes socket terminals/contacts with different spring constants towards the perimeter to mitigate substrate warpage. Usin...