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Browse Prior Art Database

SONY OUTDOORSMAN CAMERA

IP.com Disclosure Number: IPCOM000021367D
Original Publication Date: 2000-Nov-01
Included in the Prior Art Database: 2004-Jan-16
Document File: 2 page(s) / 1M

Publishing Venue

Sony Technical Digest

Related People

John Michael Reed: INVENTOR

Abstract

Currently there is no camera on the market that can handle harsh outdoor activities such as surfing, hiking, mountain biking, skiing, scuba diving, or snorkeling. The only current commercial solution to high-impact outdoor photography is the use of a disposable plastic camera, but these disposable cameras are very limited in range and picture quality,

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Sony Technical Digest, Volume 3, November 2000, ISSN 1521-5180

SONY OUTDOORSMAN CAMERA

Invention by:

John Michael Reed

Currently there is no camera on the market that can handle harsh outdoor activities such as surfing, hiking, mountain biking, skiing, scuba diving, or snorkeling. The only current commercial solution to high-impact outdoor photography is the use of a disposable plastic camera, but these disposable cameras are very limited in range and picture quality,

The Sony Outdoorsman Camera will be durable - the casing being strong and rustproof, with the casing being constructed out of titanium alloy and doubling as a lens protector. Also, the camera should be waterproof and depth proof down to two-hundred meters. The camera does not use film - instead pictures are stored digitally in an integrated circuit and later downloaded to a computer. A rechargeable NimH battery should be used for operational power, with the integrated circuits in the camera being equal to or greater than military specifications. The IC's should be shockproof and able to withstand harsh activities. A canvas strap with non-slip rubber padding would be used to secure the camera to a person's waist. The rubber padding should be thick enough to act as a floatation device if the camera is dropped in water. Finally, the camera's range should be greater than thirty-five meters.

Sony Technical Digest, Volume 3 Page 23 & 24