Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for an integrated antenna on a package or PCB

IP.com Disclosure Number: IPCOM000021636D
Publication Date: 2004-Jan-28
Document File: 3 page(s) / 32K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated antenna on a package or printed circuit board (PCB). Benefits include improved functionality and improved performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 55% of the total text.

Method for an integrated antenna on a package or PCB

Disclosed is a method for an integrated antenna on a package or printed circuit board (PCB). Benefits include improved functionality and improved performance.

Background

         Personal digital assistants (PDAs) and cell phones require a small and efficient antenna that is a stand-alone component. For smaller size and higher efficiency, the antenna should be integrated with other subsystems. Other requirements include high reliability and low cost.

To reach good efficiency, the antenna size in relation to the radiation frequency is very important. As a result, the antenna’s design and placement are always high priority. Although a dipole antenna can fit the system size well, its inconvenience to use (you have to pull it out for good quality), low efficiency, and ease of breakage make it less popular for state-of-the-art designs. Patch antennas are popular but are large. Control of its pattern and efficiency are not well established. For dual- or triple-band antenna, more design dimensions are required (see Figure 1).

General description

The disclosed method utilizes the package/PCB metal planes and traces to place an antenna in a small area of a package or PCB. The length of the antenna is realized by the long and thin trace in an arbitrary shape. Spiral is preferable. The required impedance is achieved by the size of the patch and the connection (feed) point. The package traces function as a coil. The patch functions as an antenna and can fit in a multilayer substrate of a package or PCB.

Advantages

         The disclosed method provides advantages, including:

•         Impr...