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Method for Attaching a Heat Spreader to IC Package Utilizing a Copper Carrier Plate

IP.com Disclosure Number: IPCOM000021637D
Publication Date: 2004-Jan-28
Document File: 3 page(s) / 177K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching an integrated heater spreader (IHS) to an IC package utilizing a Cu carrier plate. Benefits include elimination of substrate carrier and reduction in manufacturing cost.

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Method for Attaching a Heat Spreader to IC Package Utilizing a Copper Carrier Plate

Disclosed is a method for attaching an integrated heater spreader (IHS) to an IC package utilizing a Cu carrier plate. Benefits include elimination of substrate carrier and reduction in manufacturing cost.

Background

Typically a substrate carrier is used for flipchip assembly processing. The flipchip substrate is loaded in the carrier and is recycled after the assembly process is completed. These substrate carriers are very expensive for use in high volume manufacturing and are often damaged and need to be replaced and different carriers need to be purchased for each substrate size.

General description

The disclosed method is to utilize a Cu strip as the assembly media for packaging flipchip packages with an integrated heat spreader. The first process step is to stamp and singulate a pattern into Cu roll stock and plate it with a thin solder thermal interface material. A die is then bonded to each sectioned heat spreader. No-flow underfill (NUF) is dispensed, and the substrates are flip-chip bonded to the die and IHS. Finally, the Cu strip is singulated into individual packages.

Advantages

The disclosed method eliminates assembly processing media by utilizing a Cu strip that is patterned for direct bonding to a die, reducing the assembly cost by approximately 5%.

Detailed description

The disclosed method uses Cu strip processing as the assembly media for packaging flipchip IC package with a h...