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Method for a double-ended contact IC socket

IP.com Disclosure Number: IPCOM000021639D
Publication Date: 2004-Jan-28
Document File: 6 page(s) / 85K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a double-ended contact integrated circuit (IC) socket. Benefits include improved functionality and improved reliability.

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Method for a double-ended contact IC socket

Disclosed is a method for a double-ended contact integrated circuit (IC) socket. Benefits include improved functionality and improved reliability.

Background

The high volume manufacturing (HVM) environment mounting defects of the ball-grid array (BGA) package on printed circuit boards (PCBs) are unavoidable even though soldering processes have improved. BGA defects are caused by process, handling, and testing issues. Defects include circuit opens, bridging, and ball cracking. Additionally, the yield for BGA rework is low, resulting in loss of BGA packages.

These problems are conventionally solved using the following:

•         Specifying the ratio between the pad size and the BGA ball surface resistance opening (SRO) to pad ratio

•         Specifying the ratio of solder paste to pad

•         Lessen the strain to the BGA hot spot with process control and equipment design

The conventional solution uses BGA solder balls to interface with the PCB. Additionally, LGA pins interface with LGA packages or pins interface with BGA packages (see Figure 1).

Double-ended interface pins are conventionally used for interfacing PCBs and IC packages. Interface pins have low resistance.

General description

         The disclosed method is a double-ended contact (integrated circuit) IC socket to form contact between the IC and the PCB. Double-ended interface pins are used in the IC socket.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to making the socket detachable from the PCB

•         Improved functionality due to making the socket reusable

•         Improved functionality due to enabling the use of multiple pin tip styles, such as the chisel and crown styles

•         Improved reliability due to eliminating soldering for mounting the socket on the board surface, eliminating many surface mount technology (...