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Method for a compressed port pitch, triple stack audio connector

IP.com Disclosure Number: IPCOM000021640D
Publication Date: 2004-Jan-28
Document File: 2 page(s) / 17K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a compressed port pitch, triple stack audio connector. Benefits include improved functionality and improved ease of manufacturing.

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Method for a compressed port pitch, triple stack audio connector

Disclosed is a method for a compressed port pitch, triple stack audio connector. Benefits include improved functionality and improved ease of manufacturing.

Background

A requirement exist, to fit a triple-stack audio connector on rear I/O panels with height restrictions, such as on small form factor systems.

The conventional triple-stack audio connector is too tall to be used in small form factor systems. Conventionally, the only way to offer three audio connectors on a small form factor system is to use three discrete audio connectors or a double stack audio connector and a discrete audio connector.

Conventionally, triple-stack audio connectors have a port-to-port pitch of 12.5 mm, which is too tall for the rear I/O panel on small form factor systems.

General description

The disclosed method is a triple-stack audio connector with reduced port-to-port spacing (pitch). The key element of the method includes three 3.5-mm audio jacks integrated into a single housing with 11-mm center-to-center port spacing.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to providing a triple-stack audio connector that fits on small form factor systems

•         Improved ease of manufacturing due to requiring a single placement instead of three

Detailed description

The disclosed method has a reduced port-to-port pitch of 11 mm (see Figure 1). The typical maximum-allowed height for the rear...