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Method for a polymer-backed die overhang for stacked CSP packaging

IP.com Disclosure Number: IPCOM000021642D
Publication Date: 2004-Jan-28
Document File: 3 page(s) / 77K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a polymer-backed die overhang for stacked CSP packaging. Benefits include improved functionality and improved performance.

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Method for a polymer-backed die overhang for stacked CSP packaging

Disclosed is a method for a polymer-backed die overhang for stacked CSP packaging. Benefits include improved functionality and improved performance.

Background

         To meet the demand for thinner CSP packages, dice are increasingly thinned and become more prone to cracking during wirebonding. For spacerless T-cut die designs and the stacking of various-sized dies, the wire-bondability of thinner dice with overhang designs becomes increasingly important. However, dice are maintained at thicker designs to enable wirebonding on the overhang end (see Figure 1).

General description

         The disclosed method is the application of polymer support beneath the overhang of the die to provide mechanical support. The method enables the stacking of a wide variety of sizes and thinner die over another while extending wire-bondability.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to enabling the stacking of a wide variety of sizes and thinner die over another

•         Improved functionality due to extending the critical thickness limit of the die

•         Improved performance due to extending wire-bondability

•         Improved performance due to providing mechanical support to the critical end-portion of the die during wirebonding

Detailed description

         The disclosed method includes applying a low viscosity, non-conductive polymer material

on the wirebonded region on lower die and beneath the edge/periphery of upper die during wirebonding. The method provides mechanical support to the overhang region of the upper die.

         The disclosed method is applicable t...