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Method for a metal frame support for a JEDEC standard plastic tray

IP.com Disclosure Number: IPCOM000021644D
Publication Date: 2004-Jan-28
Document File: 2 page(s) / 114K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a metal frame support for a Joint Electronic Devices Engineering Council (JEDEC) standard plastic tray. Benefits include improved performance

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Method for a metal frame support for a JEDEC standard plastic tray

Disclosed is a method for a metal frame support for a Joint Electronic Devices Engineering Council (JEDEC) standard plastic tray. Benefits include improved performance.

Background

Conventional plastic injection molded trays are unable to maintain flatness at elevated processing temperatures above 220°C. Flatness is required for trays that are subjected to elevated temperatures. The conventional solution is metal carriers/trays that have a high, up-front capital investment in carrier/tray tooling and factory handling equipment (see Figure 1).

Description

         The disclosed method is a plastic, injection molded tray with a metal frame infrastructure.

The embedded metal frame has post anchors around which plastic is injected to increase the stability, rigidity, and flatness of a JEDEC standard plastic tray (see Figures 2 and 3).

         The key elements of the method include:

•         Metal frame

•         Rigidity of the plastic frame

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to maintaining the flatness and stability of the tray because of an embedded metal frame

Fig. 1

Fig. 2

Fig. 3

Disclosed anonymously