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Method for a variable-frequency die bonder for die-bonding applications

IP.com Disclosure Number: IPCOM000021719D
Publication Date: 2004-Feb-04
Document File: 3 page(s) / 29K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a variable-frequency die bonder for die-bonding applications. Benefits include improved functionality and improved performance.

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Method for a variable-frequency die bonder for die-bonding applications

Disclosed is a method for a variable-frequency die bonder for die-bonding applications. Benefits include improved functionality and improved performance.

Background

Requirements exist to reduce mean bond-line thickness (BLT) and tighten control of its variability.

To control the BLT, force is applied to the die during attachment to the substrate. In some cases, heated pressure is applied to keep the thin die from warping during the curing process (see Figure 1). The application time is a variable. The die-attach thickness is determined by how well the unidirectional force spreads the fillers out to the minimal thickness. If any fillers are clumped together, the mean thickness remains larger than the mean filler size (see Figure 2).

General description

The disclosed method is a variable frequency die bonder.          The key elements of the method include:

•         Variable-frequency die bonder

•         Frequency generator

•         Transducer

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to enabling one tool to vary bonding frequencies based on the bonding applications and materials used

Detailed description

The disclosed method is a variable-frequency die bonder. It enables flexibility in die bonding parameters and process windows. For example, for lower temperature bonding, ultrasonic vibrations may generate a better bond than with just temperature and force. The filler material...