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Method for a heated capillary

IP.com Disclosure Number: IPCOM000021720D
Publication Date: 2004-Feb-04
Document File: 2 page(s) / 288K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heated capillary. Benefits include improved functionality and improved performance.

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Method for a heated capillary

Disclosed is a method for a heated capillary. Benefits include improved functionality and improved performance.

Background

Conventionally, devices are preheated from below on a heater block stage for wirebonding. A room-temperature wire bond capillary comes down to the bond pad and bonds the device to the substrate to make electrical connections to the package. The device must be at a uniform elevated temperature of 150°C to 180°C to make the bond (see Figure 1 and 2). The disadvantage is that the entire device must be heated to make the bond.

General description

The disclosed method is a heated capillary for wire-bond applications to eliminate the heater block for preheating the parts to be bonded.

         The key elements of the method include:

•         Wire bond tool

•         Heated capillary

•         Heated stage

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to heating the capillary instead of requiring the heater block to preheat the device

•         Improved performance due to maintaining the device at a much lower temperature while still having the wire in the capillary at the required elevated temperature range

Detailed description

The disclosed method provides heat to the wire capillary on the wire bond tool to heat the gold wire during the bonding process. The incoming wire is rapidly heated as it is consumed in the bonding process. The gold wire is heated in place. The temperature is set at or above the required...