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Method for multistacked dice in a leaded package

IP.com Disclosure Number: IPCOM000021721D
Publication Date: 2004-Feb-04
Document File: 3 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multistacked dice in a leaded package. Benefits include improved functionality, improved performance, and improved cost effectiveness.

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Method for multistacked dice in a leaded package

Disclosed is a method for multistacked dice in a leaded package. Benefits include improved functionality, improved performance, and improved cost effectiveness.

Background

         Higher customer and functionality requirements for printed circuit boards (PCBs) require more components, especially integrated circuits (ICs). Having more components on board increases the space used on the PCB and results in higher cost. Conventionally, combining silicon in one integrated, chip-scale package (CSP) requires a ball-grid array (BGA) package interconnection. This approach is typically used for very complex devices that require more than 300 solder balls. Solder-ball interconnection is not preferred over leaded packages due to the possibility of reliability issues, such as bridging, opens, and voids, during surface mounting.

         Some simple devices, such as field-effect transistors and driver FETs (FET DRVR-FET), work in pairs and are less complex. Conventionally, these leaded packages are being mounted as two separate components in separate areas of the board. One opportunity is to combine dice in a leaded package by stacking them in one single package. This concept is also applicable to leaded packages, such as flash and microcontrollers.

         Having two die in the same package can cause thermal dissipation issues for some applications (Vreg circuitries) that require high speed and high power. An embedded copper heatsink is a conventional technology that is used in some ICs that require good heat dissipation. BGA packages cannot use embedded heatsinks due to the board area they occupy.

Conventionally, stacked dice are only connected using BGA packages. They are only used for complex ICs due to high cost (see Figure 1).

Conventional leaded packages only have one die for each package (see Figure 2).

No stacked leaded packages are conventionally available.

A requirement exists for a simple, low-cost method of enhancing the number and efficiency of internal and external electrical interconnections and signal routing between multiple, stacked dies and the leads of a lead-frame pack...