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Method for an S-shaped 3-metal flexible substrate packaging interconnect

IP.com Disclosure Number: IPCOM000021731D
Publication Date: 2004-Feb-04
Document File: 2 page(s) / 134K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an S-shaped 3-metal flexible substrate packaging interconnect. Benefits include improved functionality and improved performance.

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Method for an S-shaped 3-metal flexible substrate packaging interconnect

Disclosed is a method for an S-shaped 3-metal flexible substrate packaging interconnect. Benefits include improved functionality and improved performance.

Background

Input/output (I/O) and routing density requirements for multiple die-stacking packages continue to increase.

         Lamination of metal flexible layer 1 to metal flexible layer 2 is standard with substrates greater than 2 metal flex substrates.

Folded, stacked packages require a fold in the substrate during assembly. Conventionally, a direct metal flexible material functions like flexible circuits (see Figure 1).

General description

The disclosed method is an S-shaped 3-metal flexible substrate packaging interconnection.

         The key elements of the method include:

•         Layer of metal flexible circuit is integrated into a 2-metal flexible substrate.

•         Metal flexible layer extends out from the package body and provides a direct connection to the motherboard.

•         Solder balls on the metal flexible substrate for direct connection to the motherboard through reflow with a casing or thermal press.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to increasing die-stacking density

•         Improved performance due to shortening the signal line between the die and the motherboard

•         Improved performance due to improving the signal routing from multiple die to motherboard

Detailed description

         The assembly of this packa...