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Package Sealing Using Variable Frequency Microwave to Reflow the Doped Liquid Crystal

IP.com Disclosure Number: IPCOM000021735D
Publication Date: 2004-Feb-04
Document File: 2 page(s) / 53K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a doped liquid crystal polymer (LCP) cap to seal a package, by exposing it to variable frequency microwave (VFM) energy. Benefits include a solution that uses inexpensive materials and processes.

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Package Sealing Using Variable Frequency Microwave to Reflow the Doped Liquid Crystal

Disclosed is a method that uses a doped liquid crystal polymer (LCP) cap to seal a package, by exposing it to variable frequency microwave (VFM) energy. Benefits include a solution that uses inexpensive materials and processes.

Background

Currently, parts are hermetically sealed using an expensive ceramic package (see Figure 1).

General Description

The disclosed method uses variable frequency microwaves to heat the local region where the LCP cap is doped, thereby forming a seal around the package. In the case of matrix array packaging, the packages are singulated down the centerline of the sidewalls. Figure 2 shows the LCP VFM process of sealing a package using the current plastic package technology and equipment. Figure 3 shows the LCP cap sealed using laser technology. The laser is replaced by VFM technology when the flange or ribs are doped with microwave absorption enhanced materials. The local region is heated to the appropriate temperature for sealing the package.

Advantages

The disclosed method uses inexpensive LCP materials and processes to seal the package. It also allows for localized heating of the LCP to the device, without harming temperature sensitive regions. Temperature deltas from 50-75oC have been achieved with localized VFM heating. LCP caps can be integrated with the current BT infrastructure, and can also work with future LCP substrates expected to emerge with imprintin...