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Method for replacing IC pins with conductive adhesive fibers

IP.com Disclosure Number: IPCOM000022006D
Publication Date: 2004-Feb-18
Document File: 3 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for replacing integrated circuit (IC) pins with conductive adhesive fibers. Benefits include improved functionality and improved performance.

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Method for replacing IC pins with conductive adhesive fibers

Disclosed is a method for replacing integrated circuit (IC) pins with conductive adhesive fibers. Benefits include improved functionality and improved performance.

Background

         Microprocessors and other types of computer chips are very complicated circuits. This complexity typically means that these parts have very thin, very fragile pins to meet a reasonable package-size constraint. Because the parts are so small, the pins are very easy to break or bend. Even with the zero insertion force (ZIF) sockets used on conventional motherboards, if one pin is slightly bent, the CPU does not seat into the socket. This condition often results in bent or broken pins, which render the CPU or chip unusable.

         Significant numbers of processors and other expensive ICs are discarded because the interfacing pins are damaged by misalignment, excessive force, and other physical issues.

         Adhesive fibers are typically hook and loop micro fibers frequently used as touch fasteners (see Figure 1). They bind together items and create retention force by having hundreds (if not thousands) of individual links binding the two sides together. Individually each hook and loop is easy to break. A hundred is much harder (see Figure 2).

         If the adhesive fibers are made to be conductive, a new realm of possibilities opens up. If the fibers themselves are conductive, the whole unit is conductive.

General description

         The disclosed method replaces conventional IC pins with conductive adhesive fibers. The method becomes very useful in serial IC applications because it works best in low pad number environments.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to providing conductive hooks and loops

•         Improved performance due to easing the installation and removal of a CPU or other IC

•         Improved performance due to ensuring packaging is robust and not easily damaged

Detailed description

         The disclosed method creates a conductivity grid using conductive hooks and loops. The voltage involved is the largest factor in the space required between conductive areas....