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Multi-Aromatic Resin Selection for Pb-Free BGA Package HVM Assembly Molding

IP.com Disclosure Number: IPCOM000022012D
Publication Date: 2004-Feb-18
Document File: 2 page(s) / 63K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a multi-aromatic resin (MAR) during the Pb-free process for robust high volume manufacturing (HVM) molding. Benefits include improving the overall strength and toughness of the mold compound system.

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Multi-Aromatic Resin Selection for Pb-Free BGA Package HVM Assembly Molding

Disclosed is a method that uses a multi-aromatic resin (MAR) during the Pb-free process for robust high volume manufacturing (HVM) molding. Benefits include improving the overall strength and toughness of the mold compound system.

Background

Currently, certain types of Pb-free temperature capable mold compounds used encounter cull breakage problems in the HVM molding assembly process (see Figure 1). A higher filler loading percent is used with Sn, Ag, and Cu Pb-free solders to meet MSL requirements; however, this makes the mold compound system more brittle and causes breaks in the mold chassis. Cull breaks that happens prior to the de-gate operation in HVM causes low productivity, while increasing the amount of machine assist time during the process.

An option is to have the mold die chassis re-designed to resolve cull breaks by using those Pb-free capable mold compounds in the HVM process; however, this tooling modification incurs at least $300,000 cost (excluding spares) for Pb-free product start-ups or conversions.

General Description

The disclosed method uses a MAR in the Pb-free packaging assembly process to improve the overall strength and toughness of the mold compound system, and to improve resistance to cull breaks. The following table shows the general chemistry of a MAR in the Pb-free mold compound system, compared with a biphenyl hybrid a typical resin used for lead free package applicati...