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Method for in-line point of use chemical mixing for post-CMP cleaning

IP.com Disclosure Number: IPCOM000022017D
Publication Date: 2004-Feb-18
Document File: 3 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for in-line point of use chemical mixing for post-chemical/mechanical polishing (CMP) cleaning. Benefits include improved environmental friendliness, improved functionality, improved performance, an improved development environment, improved design flexibility, and improved cost effectiveness.

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Method for in-line point of use chemical mixing for post-CMP cleaning

Disclosed is a method for in-line point of use chemical mixing for post-chemical/mechanical polishing (CMP) cleaning. Benefits include improved environmental friendliness, improved functionality, improved performance, an improved development environment, improved design flexibility, and improved cost effectiveness.

Background


         Post-CMP chemical treatment often uses a mixture of chemicals that requires a precise concentration of its components to achieve the highest quality results. These chemicals are generally premixed and delivered to the tool. Because the chemicals sit idle, they can dissociate prior to usage, which can cause wafer-to-wafer variation due to changes in chemical concentration (see Figure 1).

Chemical mixtures that include hydrogen peroxide, H2O2, impose a unique challenge. H2O2 is unstable when mixed with other chemicals and can cause operational and quality problems.

Description

         The disclosed method is in-line point of use chemical mixing for post-CMP cleaning. The method includes a delivery system. Separate chemical lines deliver pure chemicals to the tool, which mixes them immediately prior to usage. The chemicals do not sit idle and cannot dissociate prior to usage (see Figures 2 and 3).

         The disclosed method enables the precise concentration of each chemical component in a mixture of chemicals to be poured on an individual wafer. This capability eliminates wafer-to-wafer variation due to changes in chemical concentration.        

Advantages

         The disclosed method provides advantages, including:

•         Improved environmental friendliness due to reducing chemical waste

•         Improved functionality due to being applicable to both slurry and chemical mixtures

•         Improved performance due to providing high quality wafer processing from the exact concentration of chemicals

•         Improved development environment due to enabling the selection of a wide range of concentration of chemical for process testing

•         Improved design flexibility due to providing custom chemical mixing for...