Browse Prior Art Database

Hardware Concepts Allowing for Actuated LGA Modules to be Test Probed

IP.com Disclosure Number: IPCOM000022072D
Original Publication Date: 2004-Feb-23
Included in the Prior Art Database: 2004-Feb-23
Document File: 5 page(s) / 101K

Publishing Venue

IBM

Abstract

The application of Land Grid Array (LGA) vs. more traditional Pin Grid Array (PGA) interconnect technology has created diagnostics difficulties when attempting to analyze logic related failures.Typical hardware designs that apply the required axial force to mate/maintain the interconnect have prevented the ability of test probing near the module assembly. To address this, a special means was developed to facilitate the actuation of the LGA connector (either temporally or permanently), while still allowing for in situ diagnostic probing to be supported.

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Hardware Concepts Allowing for Actuated LGA Modules to be Test Probed

Disclosed is a hardware design that facilitates a Land Grid Array (LGA) connectorized module to be test probed following actuation. The design created can be used as part of a temporary or permanent attached assembly. The creation of this design was initiated due the diagnostics difficulties originated by applying an LGA vs. more traditional Pin Grid Array (PGA) interconnect technology. Typical hardware designs that apply the required axial force to mate/maintain the interconnect force an inability to test probe near the module assembly, thus preventing logic related failures to be analyzed. The design developed facilitates both the actuation of the LGA connector (either temporally or permanently), while still allowing for in situ diagnostic probing to be supported.

Figures 1 and 2 below represent the actuation hardware scheme for a typical LGA connected module design (Ref. concept described previously in Disclosure No. POU-2000-0205). Specifically, it can be seen that the hardware completely covers the underside of the card behind the module. In doing so, the interconnect can not be test probed to diagnose system or interconnect failures.

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Figures 3 and 4 represent the temporary hardware solution implemented to allow the probability of the module using a temporary actuation hardware scheme. In this case the loading springs, the metallic stiffening plate and the insulator plate are removed and replaced with an "open" nonmetalic (polymer) frame, coil springs, hex nuts and washers. The nut & washer are advanced to deflect the coil spring and thus ap...