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Method for a thin-die rubber pick-up tip

IP.com Disclosure Number: IPCOM000022124D
Publication Date: 2004-Feb-25
Document File: 2 page(s) / 50K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thin-die rubber pick-up tip. Benefits include improved yield and improved performance.

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Method for a thin-die rubber pick-up tip

Disclosed is a method for a thin-die rubber pick-up tip. Benefits include improved yield and improved performance.

Background

         For ease of handling, silicon dice are mounted on carrier tape or placed in some other type of holder. To extract a single die, the die on the tape is run below a pick-up tip with a hollow crater-type cavity. An ejector needle moves up to lift the die from the tape or holder, and a vacuum is created, which sucks the die against the pick-up tip. Because of the crater-type cavity, the die bends and can break. As die have become thinner, silicon becomes flexible but brittle enough to cause increase in die breakage. A solution for handling dice of 3 mils or less thickness without breakage is required (see Figure 1).

         A porous chuck table is conventionally used to hold a wafer in place on a wafer saw during the cutting process.

Description

         The disclosed method includes a rubber tip with a porous cavity for removing a die from its carrier tape or other type of holder (see Figure 2). During pickup, the die is flush with the rubber tip’s surface. The porous material in the cavity provides support to the die and lessens the amount of bending and breakage that occurs (see Figure 3). Additionally, the vacuum process is improved because the volume of air to be removed is decreased due to the presence of the porous rubber material.


Advantages

         The disclosed method provides advantages, including:

·        Improved yield due to pre...