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Method for a spacer to improve mechanical performance in stacked die package assemblies

IP.com Disclosure Number: IPCOM000022269D
Publication Date: 2004-Mar-03
Document File: 4 page(s) / 694K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a spacer to improve mechanical performance in stacked die package assemblies. Benefits include improved functionality and improved performance.

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Method for a spacer to improve mechanical performance in stacked die package assemblies

Disclosed is a method for a spacer to improve mechanical performance in stacked die package assemblies. Benefits include improved functionality and improved performance.

Background

Assembly issues occur due to die stacking, such as die cracking for stacked die.

Conventional stacked-die packages use wire-bond pads, connections, and a die-attach material with a mechanical spacer (typically silicon) that is smaller than the size of the active silicon (see Figures 1 and 2).

General description

The disclosed method is a spacer for stacked-die package assemblies that reduces stress and improves mechanical performance.

         The key elements of the method include:

•         Spacer design

•         Stacked die packages

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to using a spacer to improve mechanical support in the highest stress areas of the typical stacked die configuration

•         Improved performance due to allocating an area for wire-bond connections

Detailed description

The disclosed method includes stacked die spacers that are rectangular. The design has wire-bond areas between the stacked die. The disclosed method adds a surface near the corners of the spacer to provide support and strength for the stacked die configuration. The design incorporates an indentation in the spacer for wire bond pads between the stacked die (see Figures 3 and 4).

Fig. 1

Fig. 2

Fig...