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Defect Reduction in Electroless Spray Deposition

IP.com Disclosure Number: IPCOM000022275D
Publication Date: 2004-Mar-03
Document File: 2 page(s) / 170K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for electromagnetic filtration that uses electrically controlled magnets surrounding a chemical mixing manifold. The magnets attract and hold particles, keeping them from entering into the process supply line or from clogging any in-line micro filters.

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Defect Reduction in Electroless Spray Deposition

Disclosed is a method for electromagnetic filtration that uses electrically controlled magnets surrounding a chemical mixing manifold. The magnets attract and hold particles, keeping them from entering into the process supply line or from clogging any in-line micro filters.

Background

Currently, in the Electroless plating process, the techniques for removing particles in the electroless plating bath are insufficient, causing defects, leakage, and yield loss on the wafers.

General Description

The disclosed method introduces electromagnetic filtration into the electroless metal plating process to help reduce defects and keep process lines and spray nozzles from clogging. Sonication/Ultrasonic transducers in the “Mixing Manifold” of the existing equipment are powered on at a desired power/frequency during the “plate” cycle of the Electroless Metal Plating process. The ultrasonic transducers create cavitational implosions within the desired heated plating solution. The energy released from the ultrasonic implosions effectively propagate chemical mixing with ultrasonic cavitation, and prevent metal particle nucleation in the volume of plating solution to be delivered to the wafers. A heated chemical supply tank contains heated solutions that act as the catalyst for ultrasonic transducers during the on-line mixing process. The disclosed method’s electroless Co plating process consists of the following main steps:

§         Mixing...