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Method for a heatsink release-lever

IP.com Disclosure Number: IPCOM000022475D
Publication Date: 2004-Mar-17
Document File: 2 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink release-lever. Benefits include improved functionality, improved performance, and improved design flexibility.

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Method for a heatsink release-lever

Disclosed is a method for a heatsink release-lever. Benefits include improved functionality, improved performance, and improved design flexibility.

Background

         The conventional solution uses threads to engage and disengage the heatsink and die.

The solution is expensive to manufacture because machining is required.

General description

         The disclosed method is a heatsink release lever. It uses springs and a lever to engage and disengage the heatsink and die. Using springs to control the die pressure is more reliable and repeatable than the conventional solution.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to enabling the heatsink assembly to be disengaged from the mounting pins

•         Improved performance due to the reliability and repeatability of the die pressure

•         Improved design flexibility due to enabling the use of various dies

•         Improved cost effectiveness due to eliminating the requirement for thread machining

Detailed description

The disclosed method is a lever that disengages a heatsink from a die. When not in contact with the die surface, the heatsink may be horizontally translated and removed from the board without applying damaging shear loads to the die. The heatsink is held onto the die by springs to attain the necessary die pressure. In this case, to remove the heatsink assembly, the whole assembly must be translated (slid) horizontally to disengage the heatsink mounting bracket from its mounting pins. Pressing on the end of the lever raises the heatsink from the board, disengaging the die. The lever pivots around a fulcrum so tha...