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Method for room-temperature solder ball attachment using induction heating

IP.com Disclosure Number: IPCOM000022661D
Publication Date: 2004-Mar-24
Document File: 2 page(s) / 60K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for room-temperature solder ball attachment using induction heating. Benefits include improved functionality, improved ease of manufacturing, and improved process simplicity.

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Method for room-temperature solder ball attachment using induction heating

Disclosed is a method for room-temperature solder ball attachment using induction heating. Benefits include improved functionality, improved ease of manufacturing, and improved process simplicity.

Background

Permanent warpage occurs with trays that are used during ball attachment, especially for lead-free solder balls. As a result, plastic trays, metal trays, or specialty trays may be discarded.

The through-put time (TPT) for ball-attach processing is relatively long and must be reduced.

The conventional chip attach process heats all components, such as a die, solder balls, and a substrate, in a reflow oven (see Figure 1).

General description

The disclosed method attaches solder balls to a substrate using induction heating and without a reflow oven. Only the solder balls and package bottom surface are heated with the induction heating process.

         The key elements of the method include:

•         Induction heating machine

•         Induction heating coil

•         Solder ball grid array (BGA) package

•         Substrate

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to providing a local, induction heating process

•         Improved ease of manufacturing due to significantly improving the TPT for ball attachment

•         Improved process simplicity due eliminating the use of a reflow oven, which takes minutes to heat the part to solder reflow temperature, soak, and then cool

Detailed descripti...