Browse Prior Art Database

Method for SMT beat-rate improvement through double row tape and reel

IP.com Disclosure Number: IPCOM000022665D
Publication Date: 2004-Mar-24
Document File: 5 page(s) / 78K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for surface-mount technology (SMT) beat-rate improvement through double row tape and reel. Benefits include improved functionality and improved performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 56% of the total text.

Method for SMT beat-rate improvement through double row tape and reel

Disclosed is a method for surface-mount technology (SMT) beat-rate improvement through double row tape and reel. Benefits include improved functionality and improved performance.

Background

         The placement beat rate has already been optimized with a double-board implementation in SMT chip-placement machines. With complex board designs and higher component lead counts, SMT is expected to become a bottleneck process in printed circuit board assembly (PCBA) manufacturing. One solution is to install high-speed lines or install more chip placement machines, which requires a very large investment and increases liabilities. Older models of chip placement machines may no longer provide the high beat-rate.

Conventionally, devices are packaged in tape and reel or tray packages to be mounted on boards. Typically ~90% of components are packaged using tape and reel due to better handling and easier board mounting. The tapes and reels are loaded into feeders to be placed on chip mounting machines. A nozzle picks-up the component from the reel and places it on the board (see Figures 1, 2, and 3).

Multiple components can be used on a board. In some cases, up to 24 capacitors and resistors occur per board. The nozzle still picks each piece individually due to storing each piece in one pocket hole of the single-row tape and reel.

         Measures taken to increase the SMT placement beat-rate:

•         Use faster chip shooters, such as fast component mounter (FCM) machines

•         Increase the minimum order quantity (MOQ)

•         Increase number of reels into various feeders

General description

The disclosed method includes a double-row tape and reels and two nozzles to increase the SMT placement beat-rate for any component with more than two components per board.

         The disclosed method enables cost savings to compone...