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Folded High-Q Spiral Inductor Array Embedded in a Multi-Layer Substrate

IP.com Disclosure Number: IPCOM000022679D
Publication Date: 2004-Mar-25
Document File: 3 page(s) / 20K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that achieves high-Q passive component (i.e. embedded inductor) arrays for RF packaging. Benefits include a solution with no additional costs or manufacturing processes.

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Folded High-Q Spiral Inductor Array Embedded in a Multi-Layer Substrate

Disclosed is a method that achieves high-Q passive component (i.e. embedded inductor) arrays for RF packaging. Benefits include a solution with no additional costs or manufacturing processes.

Background

The Q-factor of a system is directly related to the inductance value of the components built on a substrate. Current inductor designs are based on how to maximize the overall inductance value with respect to geometrical parameters (i.e. trace length, width, and spacing). Given the limited space, advanced design topologies are created for the passive components.

Current multiple turn inductors are fabricated on a substrate (see Figure 1). Inductors with a spiral turn (either circular or rectangular) are the most common to achieve high inductance values. Optimizing for geometrical parameters can improve the inductance to obtain a high Q-factor for a system; however, another critical parameter that affects the overall inductance is the mutual inductance between traces. High mutual inductance is due to the narrow spacing between trace lines. Therefore, it is very important to minimize the mutual inductance to increase the overall inductance of the component.

General Description

The disclosed method achieves high-Q passive component arrays for RF packaging by introducing a shielding ground plane to reduce the mutual inductance of trace lines. Trace lines with opposite current flow directions are separated into...