Browse Prior Art Database

METHOD FOR SOLDERING WIREWRAP PINS TO A BACKPLANE

IP.com Disclosure Number: IPCOM000022870D
Original Publication Date: 1976-Mar-31
Included in the Prior Art Database: 2004-Mar-27
Document File: 2 page(s) / 171K

Publishing Venue

Xerox Disclosure Journal

Abstract

Hand soldering of wirewrap pins to a backplane is a time- consuming and expensive process. In the instant techni- que, pins are inserted in a backplane and, using a suitable holding fixture, the pins are dipped into a container holding a water-soluble solder mask such that the mask covers the pins to within about .050 inches of the pin base,

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Page 1 of 2

XEROX DISCLOSURE JOURNAL

METHOD FOR SOLDERING WIRE- Proposed Classification
WRAP PINS TO ~ B~CKPL2~NE U.S. Cl, 117/201
Roy Currence mt. Cl, B44c 1/18

~LDER

SOLDER
MASK

Hand soldering of wirewrap pins to a backplane is a time-
consuming and expensive process. In the instant techni-
que, pins are inserted in a backplane and, using a suitable
holding fixture, the pins are dipped into a container
holding a water-soluble solder mask such that the mask
covers the pins to within about .050 inches of the pin
base,

The backplane is then over dried and a solder flux
is applied to the pins and board, The board is then
pre-heated and flow soldered on a wave soldering
machine to attach the pins to the backplane. The back-
plane is then washed to remove the water-soluble
solder mask from the pins.

Volume 1 Nuither 3 March 1976 21

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22 XEROX DISCLOSURE JOURNAL

Volume 1 Number 3 March 1976

[This page contains 1 picture or other non-text object]