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Method for the use of two step blades to cut copper devices without cracking and delamination

IP.com Disclosure Number: IPCOM000023819D
Publication Date: 2004-Mar-31
Document File: 2 page(s) / 44K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of two step blades to cut copper devices without cracking and delamination. Benefits include improved performance.

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Method for the use of two step blades to cut copper devices without cracking and delamination

Disclosed is a method for the use of two step blades to cut copper devices without cracking and delamination. Benefits include improved performance.

Background

Cutting copper devices with a forty-five degree bevel blade conventionally can result in the delamination of the device. Delamination is due to the blade loading with ductile copper at the edge of the bevel blade that rubs against the device surface, resulting in leakage failures at test and after reliability testing (see Figure 1).

The alternative solution is to remove the copper from the cutting area of the device.

Conventionally, aluminum devices are cut with a beveled blade to minimize the damage to the device from the cutting angle.

Description

The disclosed method uses two straight blades to cut copper devices and eliminate cracking and delamination. The contact angle of the first blade to a copper device must be 90 degrees to eliminate blade loading and the resulting device cracking and delamination. A straight blade eliminates the contact between the cutting edge and the device edge by burying the cutting edge into the silicon (see Figure 2).

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to using dual straight blades to cut

Fig. 1

Fig. 2

Disclosed anonymously