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Method for a high-heat flux evaporator for use with capillary-pumped loop cooling

IP.com Disclosure Number: IPCOM000023826D
Publication Date: 2004-Mar-31
Document File: 4 page(s) / 290K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a high-heat flux evaporator for use with capillary-pumped loop cooling. Benefits include improved functionality and improved performance.

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Method for a high-heat flux evaporator for use with capillary-pumped loop cooling

Disclosed is a method for a high-heat flux evaporator for use with capillary-pumped loop cooling. Benefits include improved functionality and improved performance.

Background

         Conventionally, high-heat flux components are cooled with integrated heatsinks (IHSs). Prototype evaporators have functional issues with the proximity of the liquid supply to the heated pan area and have difficulty operating on a level plane.

Description

         The disclosed method includes an advanced evaporator module for use with a capillary pumped loop (CPL) cooling system (see Figure 1). This evaporator module consists of a bottom part (pan) and an upper part (lid). The pan is partly filled with a sintered copper wick structure. The pan contains the liquid supply manifolds and vapor outlet ports. The pan is mounted to the electronics component requiring cooling (see Figure 2).

         The evaporator takes the place of a conventional heatsink. The system operates by transferring heat from the electronic component by the evaporation of liquid (such as water) out of the wick structure (see Figure 3). The heated vapor exits through the vapor ports and new liquid is drawn into the wick through capillary action (see Figures 4 and 5). The lid is fastened to the top of the pan to seal the system.

         The disclosed method addresses issues of liquid supply by moving the liquid supply lines away from the heated area. Multiple, large cross-sectiona...