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Thermal Performance Enhancements for Small Form Factor Flip Chip Packages

IP.com Disclosure Number: IPCOM000023835D
Publication Date: 2004-Mar-31
Document File: 3 page(s) / 173K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that embeds a heat spreader on a package's surface during the molding process. Benefits include improving thermal performance, assembly yield, and manufacturing throughput.

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Thermal Performance Enhancements for Small Form Factor Flip Chip Packages

Disclosed is a method that embeds a heat spreader on a package’s surface during the molding process. Benefits include improving thermal performance, assembly yield, and manufacturing throughput.

Background

Currently, it is difficult to improve the thermal performance of flip chip packages. In order to enhance thermal dissipation, an external heat sink or integrated heat spreader (IHS) is used, which requires expensive thermal interface greases, and additional processes for the IHS assembly (see Figure 1). For low cost flip chip options, the external heat sink increases costs for the assembly processes. In addition, the die can be easily damaged during the heat sink attachment and curing processes.

In most cases, the area molded flip chip packages are usually encapsulated by using a molding technology with or without underfilling material. The die backside can be either exposed or covered by a low thermal conductivity material.

General Description

In the disclosed method, an embedded IHS is attached to the substrates, and then the molding material is injected to finish the molding process (see Figure 2). The underfilling process is included or eliminated from the process. Alternately, the IHS shape can be designed so that the air easily escapes during the molding process. The IHS can be attached to the die backside, or can simply float on the molding compound (see Figure 3). If the IHS is attached to...