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PROCESS FOR FABRICATION OF INK JET ORIFICES

IP.com Disclosure Number: IPCOM000023934D
Original Publication Date: 1979-Apr-30
Included in the Prior Art Database: 2004-Apr-01
Document File: 2 page(s) / 313K

Publishing Venue

Xerox Disclosure Journal

Abstract

A method for forming a large number of closely spaced, accurately defined orifices in a metal plate is illustrated in the Figures. In Figure 1, there is shown a conductive substrate coated with a material which will harden when exposed to radiation, e.g., light. The radiation hardenable material may be , e.g., a photoresist material, such as du Pont Riston or Dynachem Laminar, having a thickness greater than that of the desired metal plate. A photomask representing the pattern of holes desired in the final plate is placed over the photoresist. The photoresist is exposed to light and developed providing a pattern of raised, hardened resist posts as shown in Figure 2. The area between the posts is then filled with metal by electroforming, resulting in the structure as shown in Figure 3. The electro.-formed metal is then stripped off of the conductive substrate and the resist material removed providing the plate shown in Figure 4. The described technique is a relatively inexpensive method for producing accurately formed and accurately spaced holes in quantity. The plate thus formed may be used, e.g., in an ink jet orifice array.

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Page 1 of 2

XEROX DISCLOSURE JOURNAL

PROCESS FOR FABRICATION OF INK Proposed Classification 3ET ORIFICES U~S~CL 346/140 R William R~Gardner mt CL GOld 15/16

LAMINATE AND EXPOSE

LIGHT PHOTOMASK

DEVELOP

PLATE

~LECTROFORMED METAL

STRIP

RAW PHOTORESIST

CONDUCTIVE SUBSTRATE

HARDENED RESIST

CONDUCTIVE SU8STRATE

F/G~1

F/G~2

F/G~3 I

4'-CONDUCTIVE SUBSTRATE

FINISHED ORIFICE PLATE

I Volume 4 Number 2 March/April 1979 251

P/G4 -

[This page contains 1 picture or other non-text object]

Page 2 of 2

PROCESS FOR FABRICATION OF INK 3ET ORIFICES (Cont!d)

A method for forming a large number of closely spaced, accurately defined orifices in a metal plate is illustrated in the Figures. In Figure 1, there is shown a conductive substrate coated with a material which will harden when exposed to radiation, e.g., light. The radiation hardenable material may be , e.g., a photoresist material, such as du Pont Riston or Dynachem Laminar, having a thickness greater than that of the desired metal plate. A photomask representing the pattern of holes desired in the final plate is placed over the photoresist. The photoresist is exposed to light and developed providing a pattern of raised, hardened resist posts as shown in Figure 2. The area between the posts is then filled with metal by electroforming, resulting in the structure as shown in Figure 3. The electro.~formed metal is then stripped off of the conductive substrate and the resist material removed providing the plate shown in Figure 4. The described...