Browse Prior Art Database

FABRICATION METHOD FOR ELECTROGRAPHIC STYLUS ELECTRODE HEAD

IP.com Disclosure Number: IPCOM000024289D
Original Publication Date: 1980-Apr-30
Included in the Prior Art Database: 2004-Apr-02
Document File: 2 page(s) / 110K

Publishing Venue

Xerox Disclosure Journal

Abstract

An electrographic stylus electrode head 10 is fabricated by taking a thin, anodized nickel sheet and applying a layer of dry film photoresist to one surface. This surface is pattern masked, exposed and developed to produce a linear array of grooves in the photoresist. The sheet is then placed in a copper plating bath to produce an array of square, cross-sectional copper conductor lines 12 in the linear grooves. The photoresist is removed. Next, the copper conductor-lined nickel sheet is pressed against a PC board 11 having a B stage epoxy butter coat. The B stage epoxy is cured. Next, the nickel sheet is removed leaving the copper conductor line construction peeled from the nickel sheet and embedded and secured in the cured B stage epoxy. The conductor lines 12 are tested for electrical continuity and shorts.

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XEROX DISCLOSURE JOURNAL

FABRICATION METHOD FOR ELECTRO- GRAPHIC STYLUS ELECTRODE HEAD Wendell C. Johnson

Proposed Classification
U.S. CI. 29/624 Int. C1. HOlb 13/00

David D. Thornburg

24 24

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An electrographic stylus electrode head 10 is fabricated by taking a thin, anodized nickel sheet and applying a layer of dry film photoresist to one surface. This surface is pattern masked, exposed and developed to produce a linear array of grooves in the photoresist. The sheet is then placed in a copper plating bath to produce an array of square, cross-sectional copper conductor lines 12 in the linear grooves. The photoresist is removed. Next, the copper conductor-lined nickel sheet is pressed against a PC board 11 having a B stage epoxy butter coat. The B stage epoxy is cured. Next, the nickel sheet is removed leaving the copper conductor line construction peeled from the nickel sheet and embedded and secured in the cured B stage epoxy. The conductor lines 12 are tested for electrical continuity and shorts.

The PC board 11 may have previously been provided with finger pattern 14 and a set of plated through holes 16 with connection rails 18 (shown in solid lines) connecting groups of holes 16 to a connection finger 20. Each of the plated holes 16 are in electrical contact with a conductor line 12 on one side of the board and a rail 18 on the opposite side of the board. The rails 18 and the pattern 14 are fabricated by conventional photolithographic techniques. The board 11 may then be cut along the dotted line 24. The cut edge is then lapped. The ends of the row of conductor lines 12 form an array of stylus electrodes.

Alternatively, only the connector finger pattern 14 may be fabricated on the opposite side of the board with plated through holes 22 being provided from each connector finger 20 to the conductor line side o...