Browse Prior Art Database

HIGH DENSITY ELECTRICAL CONNECTIONS TO GLASS SUBSTRATES

IP.com Disclosure Number: IPCOM000024470D
Original Publication Date: 1980-Oct-31
Included in the Prior Art Database: 2004-Apr-02
Document File: 2 page(s) / 49K

Publishing Venue

Xerox Disclosure Journal

Abstract

In liquid crystal matrix address systems having a separate electronic drive package, a large number of electrical connections in a small length, such as 120 connections per inch, must be made. This can be achieved by the configuration shown in the above figure wherein a copper coated, flexible circuit was placed in direct contact with an indium tin oxide coated glass substrate.

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XEROX DISCLOSURE JOURNAL

HIGH DENSITY ELECTRICAL CON- NECTIONS TO GLASS SUBSTRATES

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Ivo P. Gates

Proposed Classification
U.S. C1. 315/169 Int. Cl. H05b 39/00

In liquid crystal matrix address systems having a separate electronic drive package, a large number of electrical connections in a small length, such as 120 connections per inch, must be made. This can be achieved by the configuration shown in the above figure wherein a copper coated, flexible circuit was placed in direct contact with an indium tin oxide coated glass substrate.

As shown in the figure, an optically flat glass substrate 11 bearing the indium tin oxide conductor 13 is held tightly against the copper-exposed portion of the flexible circuit 15 which includes the copper conductors 17 between the plastic layers 19 and 21. The assembly is held tightly together by the action of the clamp 23, thin sponge 25 and glass pressure plate 27.

Volume 5 Number 5 September/October 1980 499

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XEROX 500 DISCLOSURE JOURNAL

Volume 5 Number 5 September/October 1980

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