Browse Prior Art Database

ELECTRODE CONFIGURATION FOR LIQUID CRYSTAL DISPLAY

IP.com Disclosure Number: IPCOM000024572D
Original Publication Date: 1981-Feb-28
Included in the Prior Art Database: 2004-Apr-02
Document File: 2 page(s) / 76K

Publishing Venue

Xerox Disclosure Journal

Abstract

The use of row-column addressed liquid crystal elements for high resolution large panel displays has been limited by the complexity and prohibitively high costs of control lead interconnections and driver hardware. Savings in both cost and complexity can be realized by stacking insulated and electrically isolated control electrodes in the interstices formed between the display electrodes.

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XEROX DISCLOSURE JOURNAL

ELECTRODE CONFIGURATION FOR LIOUID CRYSTAL DISPLAY
Ivo P. Gates

Proposed Classification
U.S. C1. 340/718 Int. C1. G09f 9/30

FIG.

I

FIG.

2

40

The use of row-column addressed liquid crystal elements for high resolution large panel displays has been limited by the complexity and prohibitively high costs of control lead interconnections and driver hardware. Savings in both cost and complexity can be realized by stacking insulated and electrically isolated control electrodes in the interstices formed between the display electrodes.

Figure 1 shows a portion of a planar array of transparent display electrodes 10 which are conventionally formed upon a glass substrate. For electrical input, each display electrode 10 includes a connector tab 12. As illustrated, these laterally extending tabs incidentally function to separate the main bodies of adjacent electrodes, forming gaps 20 therebetween. Since the lateral dimensions of gaps 20 are small relative to those of electrodes 10, minimum visible discontinuity is observed in the display. A multilayered control sandwich 30 is positioned within the lateral confines of gap 20. Control sandwich 30 is formed by alternately depositing layers of conductive 32 and insulative material 34 to provide control connections between selected connector tabs 12 on the display electrodes and termination pads 40 for driver chip 50. As illustrated in the cross-sectional view of Figure 2, conductors 32 are preferably of un...