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INSULATING LAYERS FOR METAL CROSS-OVERS FROM POLYPARAXYLYLENE

IP.com Disclosure Number: IPCOM000024868D
Original Publication Date: 1982-Aug-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 2 page(s) / 40K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is the use of polyparaxylylene as an insulating layer between metal bus bars crossing one another in an integrated circuitry system. In one embodiment, there is provided a substrate with a first metal layer, followed by depositing thereon a polyparaxylylene film utilizing a vapor phase polymerization process, overcoating the polymerized polyparaxylylene film with a second metal layer, followed by an active oxygen plasma etching of the polyparaxylylene in the open areas resulting in an insulating polyparaxylylene film at the metal crossover.

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CEROX DISCLOSURE JOURNAL

INSULATING LAYERS FOR METAL CROSS- OVERS FROM POLYPARAXYLYLENE
H. Ronald Thomas

Proposed Classification
U.S. C1. 148/175

Int. C1. HOll 7/36

Fang-Chen Luo

Disclosed is the use of polyparaxylylene as an insulating layer between metal bus bars crossing one another in an integrated circuitry system. In one embodiment, there is provided a substrate with a first metal layer, followed by depositing thereon a polyparaxylylene film utilizing a vapor phase polymerization process, overcoating the polymerized polyparaxylylene film with a second metal layer, followed by an active oxygen plasma etching of the polyparaxylylene in the open areas resulting in an insulating polyparaxylylene film at the metal crossover.

Volume 7 Number 4 July/August 1982 22 1

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  XEROX DISCLOSURE JOURNAL Volume 7 Number 4 July/August 1982

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