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LEAD FRAME ASSEMBLY FOR INK JETS

IP.com Disclosure Number: IPCOM000024986D
Original Publication Date: 1983-Apr-30
Included in the Prior Art Database: 2004-Apr-04
Document File: 2 page(s) / 70K

Publishing Venue

Xerox Disclosure Journal

Abstract

An ink jet printing machine comprises individual cavit - ts hav,.ig a trans - ucer, a fluid channel, elastomer chute, outer body and ink jet aperture. Each module is generally assembled individually. Production would be greatly improved if the modules could be assembled as batches. A batch process uses a lead frame 3 comprising a strip of ferrous alloy metal with leads 2 for the device extending from one side of the strip. Strip stock, in this form, may be patterned by conventional photofabrication processes, stamping, dye cutting or any other suitable technique. Dimensions of 0.001 inch can be routinely maintained. The final part is then plated with a suitable metal to facilitate lead bonding and minimize corrosion. Typical thicknesses of the lead frame range from about a few thousandths of an inch to 50 thousandths of an inch.

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EROX DISCLOSURE JOURNAL

LEAD FRAME ASSEMBLY FOR ~~ -~ INK JETS __ ~
John R. Debesis

Proposed Classification
U.S. C1. 178/6.6

Int. C1. H041 21/00

~~

An ink jet printing machine comprises individual cavit ~

3

ts hav,.ig a trans

                                            - ucer, a fluid channel, elastomer chute, outer body and ink jet aperture. Each module is generally assembled individually. Production would be greatly improved if the modules could be assembled as batches. A batch process uses a lead frame 3 comprising a strip of ferrous alloy metal with leads 2 for the device extending from one side of the strip. Strip stock, in this form, may be patterned by conventional photofabrication processes, stamping, dye cutting or any other suitable technique. Dimensions of 0.001 inch can be routinely maintained. The final part is then plated with a suitable metal to facilitate lead bonding and minimize corrosion. Typical thicknesses of the lead frame range from about a few thousandths of an inch to 50 thousandths of an inch.

Transducers 1 are attached to lead pairs 2. The leads may be bent at right angles to provide more support for the relatively large transducer. A manual lead bonder and automatic bowl feed can be used to perform this operation with throughputs up to a few thousand lead bonds per hour. Positioning of the leads 2 can be readily controlled to 0.001 inch. Once the lead bonding operation has been completed, all

Volume 8 Number 2 March/April 1983 93

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