Browse Prior Art Database

ELECTRO-OPTICAL SUBSYSTEM FOR IMAGE INPUT TERMINAL

IP.com Disclosure Number: IPCOM000025149D
Original Publication Date: 1983-Oct-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 4 page(s) / 156K

Publishing Venue

Xerox Disclosure Journal

Abstract

An electro-optical subsystem 5 is shown in Figures 1 - 4 which provides the following functions for an image input terminal: (1) illumination; (2) projection optics; (3) imaging; (4) video pre-processing; and (5) image processing in a compact modular construction.

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Page 1 of 4

XEROX DISCLOSURE JOURNAL

ELECTRO-OPTICAL SUBSYSTEM FOR IMAGE INPUT TERMINAL Ronald G. Matteson
Richard H. Tuhro

7

Proposed Classification
U.S. C1. 358/285 Int. CI. H04n 1/04

FIG. I

FIG. 2

Volume 8 Number 5 September/October 1983 439

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Page 2 of 4

ELECTRO-OPTICAL SUBSYSTEM FOR IMAGE INPUT TERMINAL (Cont'd)

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FIG. 3

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    XEROX DISCLOSURE JOURNAL Volume 8 Number 5 September/October 1983

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440

[This page contains 1 picture or other non-text object]

Page 3 of 4

ELECTRO-OPTICAL SUBSYSTEM FOR IMAGE INPUT TERMINAL (Cont'd)

An electro-optical subsystem 5 is shown in Figures 1 - 4 which provides the following functions for an image input terminal: (1) illumination; (2) projection optics; (3) imaging; (4) video pre-processing; and (5) image processing in a compact modular construction.

Illumination is provided by a simple fluorescent lamp 6 with cooperating reflector
7. The projection optics lens 9 consists of a linear array of gradient index optical fibers. Lamp 6, reflector 7, and lens 9 are mounted on an upright extrusion 10 which is fastened to a base member in the form of a rectangular bar 12. Bar 12 is machined to form a sharp right angle along an axis parallel to the X-scan axis (at
13) for mounting and registering the individual sensor chips 14 which form a Full- Width Scanning Array (FWA) 15.

The upper horizontal surface of the bar 12 serves as a substrate 16 for the printed wiring interconnections for the video image signal pre-processine; and image processing circuitry 17, 18, and for interconnections to and between the sensor chips 14 of the FWA 15.

In assembly, the sensor chips 14 of FWA 15 are located in proper position by abutting the chips 14 against the right-angle 13 formed in bar 12 and against each other. The entire array of chips 14 is then cemented to the print wiring substrate 16 by means of a suitable semi-conductive epoxy adhesive which automatically forms the interconnections among the sensor chips 14 and between the chips 14 and the printed wiring substrate 16. A mask overlay 21 is placed over the,array of sensor chips 14 to define the viewing field of the sensor chips in the Y-scan direction and to assure perfect alignment.

Any video pre-processing circuitry 17 for amplifying, image signal or pixel cor- rection, etc. functions which is not included on the sensor chips 14 themselves is mounted on the printed w...