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ELECTROFORMED JOINING OF INK JET APERTURE PLATES

IP.com Disclosure Number: IPCOM000025173D
Original Publication Date: 1983-Dec-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 2 page(s) / 53K

Publishing Venue

Xerox Disclosure Journal

Abstract

High resolution microlithography is essential to the fabrication of precision ink jet aperture plates. The longest dimension over which these processes are conven-tionally available is currently four inches. This dimension is closely tied to the largest size of silicon wafers that can be economically grown. For the extended arrays, other methods must be considered.

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XEROX DISCLOSURE JOURNAL

ELECTROFORMED JOINING OF INK JET APERTURE PLATES U.S. Cl. 346/75 Joel M. Pollack

Proposed Classification

Int. C1. Gold 15/18

High resolution microlithography is essential to the fabrication of precision ink jet aperture plates. The longest dimension over which these processes are conven- tionally available is currently four inches. This dimension is closely tied to the largest size of silicon wafers that can be economically grown. For the extended arrays, other methods must be considered.

A technique for producing extended arrays is to use those processes currently available to provide one inch long aperture plates. Selected aperture plates would subsequently be mounted upon an alignment fixture that serves to electrically connect adjacent aperture plates as cathodes. A gold and/or nickel anode would then be used to plate together or join adjacent aperture plates, while at the same time passivating each piece and the newly formed joint. Use of electrode thieves and shields will prevent excessive plating those regions surrounding the orif ices.

The joined member will possess orifices equal to that of smaller plates, aligned to the tolerance of the electrode holding fixture. Parts beyond the range of existing microlithography will be enabled through this technique.

Volume 8 Number 6 November/December 1983 493

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    XEROX DISCLOSURE JOURNAL Volume 8 Number 6 November/December 1983...