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Browse Prior Art Database

STABLE CONDUCTIVE DEVELOPER COMPOSITIONS

IP.com Disclosure Number: IPCOM000025194D
Original Publication Date: 1983-Dec-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 2 page(s) / 61K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is an improved stable conductive developer composition containing first resin particles of styrene methacry late copolymers grafted with or containing a low molecular weight wax composition, second resin particles of a styrene, acrylate, acrylonitrile terpolymer, pigment particles, colloidal silica additive particles, fatty acid metal salt additive particles and uncoated ferrite carrier particles.

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YEROX DISCLOSURE JOURNAL

STABLE CONDUCTIVE DEVELOPER Proposed Classification COMPOSITIONS US. Cl. 430/108 Robert 3. Nash
9/00 Int. Kent A. Randall Cl. G03g

Disclosed is an improved stable conductive developer composition containing first resin particles of styrene methacry late copolymers grafted with or containing a low molecular weight wax composition, second resin particles of a styrene, acrylate, acrylonitrile terpolymer, pigment particles, colloidal silica additive particles, fatty acid metal salt additive particles and uncoated ferrite carrier particles.

Examples of the first resin particles include styrene n/butylmethacrylate copoly- mers, while the second resin particles can contain a crosslinked terpolymer resin of styrene, butylacrylate, and acrylonitrile. Fatty acid metal salt additive particles include zinc sterate, while the carrier particles can be comprised of uncoated ferrite cores containing iron, zinc, and manganese, or iron, copper, nickel, zinc, and manganese. Low molecular weight waxes that can be included in the developer composition are comprised of a polyethylene or polypropylene wax of a molecular weight of from about 1,000 to about 5,000.

The colloidal silica additive particles are present in the developer composition in an amount of from about 0.1 percent by weight to about 1 percent by weight, while the metal salt additive particles can be incorporated into the developer composi- tion in an amount of from.about 0.1 percent by weight to...