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TECHNIQUES TO ENABLE THE FABRICATION OF WIDE, FLAT SILICON MICRODEFLECTORS

IP.com Disclosure Number: IPCOM000025347D
Original Publication Date: 1984-Oct-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 4 page(s) / 146K

Publishing Venue

Xerox Disclosure Journal

Abstract

TECHNIOUES TO Eh'ABLE THE FAERICATION OF WIDE, FLAT SILICON MICRO- DEFLECTORS (Cont'd) - 350 XEROX DISCLOSURE JOURNAL Volume 9 Number 5 September/October 1984 TECHNIQUES TO ENABLE THE FABRICATION OF WIDE, FLAT SILICON MICRO- DEFLECTORS (Cont'd)

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XEROX DISCLOSURE JOURNAL

TECHNIQUES TO ENABLE THE FABRICATION OF WIDE, FLAT SILICON MICRODEFLECTORS Martin E. Banton

Proposed Classification
U.S. C1. 358/208 Int. C1. H04n 3/08

Mehdi N. Araghi

FIG 2

Volume 9 Number 5 September/October 1984 349

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TECHNIOUES TO Eh'ABLE THE FAERICATION OF WIDE, FLAT SILICON MICRO- DEFLECTORS (Cont'd) -

350 XEROX DISCLOSURE JOURNAL

Volume 9 Number 5 September/October 1984

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TECHNIQUES TO ENABLE THE FABRICATION OF WIDE, FLAT SILICON MICRO- DEFLECTORS (Cont'd)

"I

Referring to Figure 1, in applications that require wide (width 30-35 microns) microdeflectors 5, the thermal expansion difference between the Silicon (Si) base 8 and Silicon Dioxide (Si02) finger 6, introduces cupping or as referred to in the literature in a general sense, wrinkling.

Cupping arise from the fact that the SiO not only wishes to expand along its length (L), but also along its width (W). 2s the finger width (Wl increases, the inability of the Si02 which is near the line of attachment to the Si base 8 to expand, coupled with the ability of the freed Si02 farther from the attachment line to expand, introduces strain which results in the cupped contour 7 shown. While post etch metallization can eliminate the severe curling back of microdeflectors, post etch metallization cannot eliminate cupping because the effect is produced not by the presence of metal but by the fact that one end of the microdeflector is free to expand and the other end is rigidly attached to the silicon base 8.

Where the use of wide fingers is mandated, it is imperative that cupping be eliminated. Not only does cupping introduce spurious effects into images (i.e., distortion, low contrast, etc.), it also significantly reduces the life of the microdeflector. This is because bending a cupped surface introduces stress concentrations much greater than those encountered when a flat surface is similarly bent.

    XEROX DISCLOSURE JOIJRNAL Volume 9 Number 5 September/October 1984 35 1

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TECHNIQUES TO ENABLE THE FABRICATION OF WIDE, FLAT SILICON MICRO- DEFLECTOR S ( Con t Id)

Four techniq...