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SILICON MICRODEFLECTOR WAFER DESIGN FOR ELECTRO-DEPOSITION OF PYRROLE

IP.com Disclosure Number: IPCOM000025595D
Original Publication Date: 1986-Aug-31
Included in the Prior Art Database: 2004-Apr-04
Document File: 4 page(s) / 157K

Publishing Venue

Xerox Disclosure Journal

Abstract

Silicon microdeflectors comprise a row of flexible fingers supported for bending movement in cantilever fashion on a silicon base In fabricating microdeflectors which will absorb light, pyrrole, which is used as the light absorbing material, is electro-chemically deposited on a layer of gold previously deposited on the surface of the individual fingers

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XEROX DISCLOSURE JOURNAL

SILICON MICRODEFLECTOR WAFER Proposed Classrfication DESIGN FOR ELECTRO-DEPOSITION
OF PYRROLE
Norman E. Wright

U S. C1.156/662

Int. c1. B44c 1/22

Volume 11 Number 4 July/August 1986 153

[This page contains 1 picture or other non-text object]

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SILICON MICRODEPLECTOR WAFER DESIGN FOR ELECTRO-DEPOSITION OF PYRROLE (Cont'd)

Silicon microdeflectors comprise a row of flexible fingers supported for bending movement in cantilever fashion on a silicon base In fabricating microdeflectors which will absorb light, pyrrole, which is used as the light absorbing material, is electro-chemically deposited on a layer of gold previously deposited on the surface of the individual fingers

However, to do this, the microdeflector must be electrically connected to a voltage source to effect electro-deposition, and this necessitates that some means be provided for connecting all of the microdeflectors to the voltage source at once. Further, unless steps are taken, all areas of the wafer that are in electrical contact with the voltage source and with the electrolyte including bonding pads and wires, gold traces, and substrate holder connections will be coated with pyrrole. Since this results in a significant voltage drop along the runs from the point of electrical contact to the fingers, little or no deposition of pyrrole will occur on the surfaces of the fingers where the coating is desired If a material is used to isolate the conductive runs to the microdeflectors, one that is chemically stable in the electro-deposition solution must be used.

In the proposed process and referring to the drawing Figure, a silicon wafer 3 has a succession of arrays 4a, 4b, 4n, in process thereon, each array having a predetermined number of flexable macrodeflector fingers 5a, 5b,. ..5n thereon arranged in a linear row or array Preparatory to the deposition of pyrrole, the fingers have a layer of gold deposited on the surface thereof and are electrically connected by large conductor runs 8 of gold. This permits electrical contact to be made with a common voltage source 6 at a singIe point on the wafer 3 for all of the microdeflector fingers 5a, 5b, . 5n during the pyrrole processi...