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PLANAR MAGNETRON SPUTTERING PHOTORECEPTOR DEPOSITION

IP.com Disclosure Number: IPCOM000026544D
Original Publication Date: 1992-Aug-31
Included in the Prior Art Database: 2004-Apr-06
Document File: 4 page(s) / 116K

Publishing Venue

Xerox Disclosure Journal

Abstract

A planar magnetron sputtering process for uniformly coating alloy based photoreceptor devices is disclosed. In conventional drum type photoreceptor manufacturing processes, vacuum sublimation coating is a technique commonly used. A disadvantage of the vacuum coating process may be variation in composition of a condensed coating as a consequence of selective fractionation of the alloy coating materials during sublimation. Variability of the condensed coating may lead to variability in performance characteristics of the finished photoreceptor device.

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XEROX DISCLOSURE JOURNAL

PLANAR MAGNETRON Proposed Classification SPUTTERING FOR U.S. C1.430/056 PHOTORECEPTOR DEPOSITION Int. C1. G03g 15/00 Robert C. Allen

TARGET FIG.

(-HW

T

CATHODE

XEROX DISCLOSURE JOURNAL - Vol. 17, No. 4 July/August 1992 271

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Page 2 of 4

PLANAR MAGNETRON SPUTTERING FOR PHOTORECEPTOR DEPOSITION(Cont'd)

NG.

FIG.

272 XEROX DISCLOSURE JOURNAL - VoI. 17, No. 4 July/August 1992

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Page 3 of 4

PLANAR MAGNETRON SPUTTERING FOR PHOTORECEPTOR DEPOSITION(Cont'd)

A planar magnetron sputtering process for uniformly coating alloy based photoreceptor devices is disclosed. In conventional drum type photoreceptor manufacturing processes, vacuum sublimation coating is a technique commonly used. A disadvantage of the vacuum coating process may be variation in composition of a condensed coating as a consequence of selective fractionation of the alloy coating materials during sublimation. Variability of the condensed coating may lead to variability in performance characteristics of the finished photoreceptor device.

An improved photoreceptor coating process may be accomplished by planar magnetron sputtering of photosensitive materials, for example, selenium alloys, on a photoreceptor drum to obtain compositionally uniform alloy coatings. The planar magnetron sputtering process comprises providing a cathode and target assembly of required length as shown in Fig. 1, and sputtering the target material onto the surface of planetary rotating phot...