Browse Prior Art Database

APERTURE PROCESS FOR FULL WIDTH ARRAY BAR

IP.com Disclosure Number: IPCOM000026717D
Original Publication Date: 1993-Jun-30
Included in the Prior Art Database: 2004-Apr-06
Document File: 4 page(s) / 195K

Publishing Venue

Xerox Disclosure Journal

Abstract

A full-width read-bar, suitable for use in a raster input scanner (RIS), is assembled from several discrete electro-optical chips as described in U.S. Patent No. 4,976,802 to LeBlanc, issued December 11,1990, for a 'Trocess for Assembling Smaller Scanning or Printing Arrays Together to Form a Longer Array". The required alignment of the adjoining pixels in the Y-dimension is critical and must be less than a few microns. The disclosed method involves the delineation of a single line aperture across the whole array, done after the dies are attach to the substrate, and would guarantee perfect alignment of the aperture, instead of being subjected to cumulative errors inherent in the physical placement of the photosites across the individual chips.

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XEROX DISCLOSURE JOURNAL

APERTURE PROCESS FOR FULL Proposed Classification WIDTH ARRAY BAR U.S. C1.156/273.9 Ewart 0. LeBlanc Int. C1. B32b 31/00

A full-width read-bar, suitable for use in a raster input scanner (RIS), is assembled from several discrete electro-optical chips as described in U.S. Patent No. 4,976,802 to LeBlanc, issued December 11,1990, for a 'Trocess for Assembling Smaller Scanning or Printing Arrays Together to Form a Longer Array". The required alignment of the adjoining pixels in the Y-dimension is critical and must be less than a few microns. The disclosed method involves the delineation of a single line aperture across the whole array, done after the dies are attach to the substrate, and would guarantee perfect alignment of the aperture, instead of being subjected to cumulative errors inherent in the physical placement of the photosites across the individual chips.

The aperture process is applicable to a single chip, or an array of assembled chips, and is executed between the diebonding and wirebonding stages of the overall full-width array assembly process. The technique used is based on the definition of an approximately 43.5 micron line over the sensor array through a suitable photo method. A diazo lacquer is applied to the bar and a line is delineated with ultraviolet (UV) light and an appropriate aperture. Development is accomplished by exposure to Ammonia vapor. This approach has significant advantages over other processes.

The process for producing the single line aperture is as follows, and is accomplished in seven primary steps. Cycle time optimization may be achieved as the steps are automated or eliminated. For example, laser exposure will eliminate step 5. The times listed with each step are merely a guide and do not reflect setup time.

1) Sample Preparation 30 minutes

Sensitizing solution of Template Lacquer #531-8 comes in two components. The sensitizing chemical (component A) and the liquid carrier (component B). These are prepared for application by mixing 1 gram of the diazo powder (A) to 30 ml. of B. The mixing may be done in a glass, plastic, aluminum or stainless steel container. With mild agitation a clear solution is obtained in approximately 10 minutes. To this, slowly add a mixture of 12 ml. celusolve acetate and 18 ml. methanol. (Note: Add Methanol to Celusolve acetate and not the reverse). Continue agitation for an additional 2 minutes. Using a syringe and Milipore .8 micron filtedprefilter in stainless steel holder dispense adequate quantity of lacquer into the spray cup. Cover until ready to be used.

XEROX DISCLOSURE JOURNAL - Vol. 18, No. 3 May/June 1993 241

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APERTURE PROCESS FOR FULL WIDTH ARRAY BAR (Cont'd)

Prepare only the amount of sensitizing solution for one day. (Note: Use standard precautions for handling organic solvents.)

2) Cleaning Bar 2 minutes

Using cotton swabs soaked in acetone, gently wipe the surf...