Browse Prior Art Database

INK JET PRINTHEAD WITH SEALED MANIFOLD AND PRINTHEAD DIE

IP.com Disclosure Number: IPCOM000026890D
Original Publication Date: 1994-Apr-30
Included in the Prior Art Database: 2004-Apr-07
Document File: 4 page(s) / 160K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is a thermal ink jet printhead comprising a heat sinking substrate, a heater plate with wire bond pads mounted on the substrate, a printhead die mounted on the heater plate comprising a channel section with an ink inlet, an interconnecting board bonded to the substrate having wire bond pads corresponding to the pads of the heater plate, a plurality of wire bonds electrically interconnecting the wire bond pads on the heater section and the interconnection board, a manifold mounted to the substrate with an inlet contiguous with the inlet of the printhead die and overlapping the die and heater plate to form a cavity between the upper surface of the heater plate and lower surface of the manifold, a sealant applied to the edges of the contiguous inlets substantially but not completely around said edges with at least a portion of one side of the die inlet being free of sealant, and an encapsulant encapsulating the wire bonds, at least partially filling the cavity, and at least partially sealing the inlets to form a continuous passageway. The encapsulant may partially fill the cavity to form a wall of the inlet of the printhead die contiguous with the inlet of the manifold to form the continuous passageway. Additionally, the manifold may comprise a surface extended to commonly form a wall of the contiguous inlets and to define the cavity between the printhead die and the manifold when positioned over the substrate.

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Page 1 of 4

XEROX DISCLOSURE JOURNAL

INK JET PRINTHEAD WITH SEALED MANIFOLD AND PRINTHEAD DIE Lawrence H. Herko
Peter J. Nystrom

Proposed Classification

U.S. C1.3461075

lit. C1. Gold 15/18

66

XEROX DISCLOSURE JOURNAL - Vol. 19, No. 2 MarcWApril 1994 113

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INK JET PRINTHEAD WITH SEALED MANIFOLD AND PRINTHEAD DIE (Cont'd)

Disclosed is a thermal ink jet printhead comprising a heat sinking substrate, a heater plate with wire bond pads mounted on the substrate, a printhead die mounted on the heater plate comprising a channel section with an ink inlet, an interconnecting board bonded to the substrate having wire bond pads corresponding to the pads of the heater plate, a plurality of wire bonds electrically interconnecting the wire bond pads on the heater section and the interconnection board, a manifold mounted to the substrate with an inlet contiguous with the inlet of the printhead die and overlapping the die and heater plate to form a cavity between the upper surface of the heater plate and lower surface of the manifold, a sealant applied to the edges of the contiguous inlets substantially but not completely around said edges with at least a portion of one side of the die inlet being free of sealant, and an encapsulant encapsulating the wire bonds, at least partially filling the cavity, and at least partially sealing the inlets to form a continuous passageway. The encapsulant may partially fill the cavity to form a wall of the inlet of the printhead die contiguous with the inlet of the manifold to form the continuous passageway. Additionally, the manifold may comprise a surface extended to commonly form a wall of the contiguous inlets and to define the cavity between the printhead die and the manifold when positioned over the substrate.

The liquid encapsulant can be partially injected into the cavity between the printhead die and the manifold to form a wall of the inlet of the printhead die contiguous with the inlet of the manifold. The manifold may comprise a surface extended to commonly form one wall of the inlet of the printhead die and to define a wall of the cavity between the heater plate and the manifold when positioned over the mounted printhead die.

Also disclosed is a method of sealing components of a thermal ink jet printhead. The method comprises the st...