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Browse Prior Art Database

PLUNGE CUTTING OF BONDED SILICON WAFERS

IP.com Disclosure Number: IPCOM000026971D
Original Publication Date: 1994-Oct-31
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 54K

Publishing Venue

Xerox Disclosure Journal

Abstract

It is very difficult to achieve micron level cut placement accuracy while cutting bonded silicon wafers into a plurality of individual thermal ink jet printheads. The angle at which the blade approaches the silicon wafer changes as a function of the cut position around the circumference of the wafer. The blade bends proportionally towards the obtuse angle between the blade and silicon wafer. Current practice is to reduce the depth of cut and utilize multiple passes which is time consuming and puts additional constraints on realignment and step accuracy.

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XEROX DISCLOSURE JOURNAL

PLUNGE CUTTING OF BONDED SILICON WAFERS US. C1.156/633 Lawrence H. Herko

Proposed Classification

Int. C1. HOll21/306

It is very difficult to achieve micron level cut placement accuracy while cutting bonded silicon wafers into a plurality of individual thermal ink jet printheads. The angle at which the blade approaches the silicon wafer changes as a function of the cut position around the circumference of the wafer. The blade bends proportionally towards the obtuse angle between the blade and silicon wafer. Current practice is to reduce the depth of cut and utilize multiple passes which is time consuming and puts additional constraints on realignment and step accuracy.

This problem is solved if the blade is plunged into the top surface of the silicon wafer inline with each of the dicing streets or cutting paths, then proceeding through the street in a single pass. By doing this, equal force is maintained on both sides of the blade throughout the wafer cut, eliminating blade bending and improving cut placement accuracy. This will eliminate the need for secondary realignment and should reduce the amount of time to complete the severing of a wafer into a plurality of parts.

XEROX DISCLOSURE jOURNAL - Vol. 19, No. 5 Septernber/October 1994 353

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354 XEROX DISCLOSURE JOURNAL - Vol. 19, No. 5 SeptemberiOctober 1994

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