Browse Prior Art Database

SILICON WAFER DIE SITE MAPPING AND WAFER TRACKING MEDIUM

IP.com Disclosure Number: IPCOM000027039D
Original Publication Date: 1994-Dec-31
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 103K

Publishing Venue

Xerox Disclosure Journal

Abstract

A method for storing and transferring thermal ink jet wafer probe testing and identification data from a wafer fabrication source to a remote wafer assembly facility. Lot information, wafer serial number and test results for a heater wafer in a thermal ink jet die are downloaded from a probe tester and a programming station into a reusable nonvolatile memory device. The memory device is placed adjacent the silicone wafer and shipped to a remote wafer assembly facility. At the remote wafer assembly facility, lot information, wafer serial number and test results are retrieved from the memory device and used for further manufacture of the thermal ink jet die head.

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XEROX DISCLOSURE JOURNAL

SILICON WAFER DIE SITE MAPPING AND WAFER TRACKING MEDIUM Int. C1. HOll 21/00 Vincent A. Burolla

Proposed Classification
U.S. C1.437/250

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FIG. I FIG. 2

XEROX DISCLOSURE JOURNAL - Vol. 19, No. 6 November/December 1994 531

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SILICON WAFER DIE SITE MAPPING AND WAFER TRACKING MEDIUM(Cont'd)

A method for storing and transferring thermal ink jet wafer probe testing and identification data from a wafer fabrication source to a remote wafer assembly facility. Lot information, wafer serial number and test results for a heater wafer in a thermal ink jet die are downloaded from a probe tester and a programming station into a reusable nonvolatile memory device. The memory device is placed adjacent the silicone wafer and shipped to a remote wafer assembly facility. At the remote wafer assembly facility, lot information, wafer serial number and test results are retrieved from the memory device and used for further manufacture of the thermal ink jet die head.

The current method of transferring lot information, wafer serial number and test results from a fabrication source to an assembly facility is to use either hard copy or floppy disk information from the probe tester. Tracking the lot information and test results with the wafers can be cumbersome.

Referring to Figures 1 and 2, a reusable nonvolatile memory device 12 in the form of a hermetically sealed, nickel plated, stainles...