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Browse Prior Art Database

HIGH-VOLTAGE INTERCONNECT FOR A PRINTED CIRCUIT BOARD

IP.com Disclosure Number: IPCOM000027189D
Original Publication Date: 1995-Aug-31
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 93K

Publishing Venue

Xerox Disclosure Journal

Abstract

The present disclosure describes a high-voltage interconnection device that takes advantage of the flexural strength and modulus of common printed wiring board (PWB) materials. Typically, deflection of such materials results in a force which brings the PWB back into its planar shape. The proposed device relies on these properties to enable the formation of an interconnection with an external circuit or device. As will be understood from the following description, the proposed device further eliminates the necessity for springs, pins, sockets, or connector body "float" to accommodate the axial location tolerances of mating parts.

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XEROX DISCLOSURE JOURNAL

HIGH-VOLTAGE INTERCONNECT Proposed Classification FOR A PRINTED CIRCUIT BOARD
U.S. John M. Randall C1.361/380
Int. C1. H02b 01/00

XEROX DISCLOSURE JOURNAL - Vol. 20, NO. 4 July/August 1995 359

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HIGH-VOLTAGE INTERCONNECT FOR A PRINTED CIRCUIT BOARD (Cont'd)

The present disclosure describes a high-voltage interconnection device that takes advantage of the flexural strength and modulus of common printed wiring board (PWB) materials. Typically, deflection of such materials results in a force which brings the PWB back into its planar shape. The proposed device relies on these properties to enable the formation of an interconnection with an external circuit or device. As will be understood from the following description, the proposed device further eliminates the necessity for springs, pins, sockets, or connector body "float" to accommodate the axial location tolerances of mating parts.

As illustrated in the figure, one embodiment of the device is produced by isolating a finger of printed wiring board material 10 from the remainder of the PWB 8 by a U-shaped channel or opening 12. Located on a surface of finger 10 is a high-voltage interconnection or contact 14, which is preferably formed of a highly conductive material capable of being soldered or similarly fused to the conductive surface of PWB 8. In addition, a conductive trace 16 serves to connect the contact 14 to other app...