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IMPROVED NICKEL SUBSTRATE PHOTOCONDUCTOR GROUNDING OF END CAPS

IP.com Disclosure Number: IPCOM000027262D
Original Publication Date: 1995-Dec-31
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 66K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is a method for the adapting nickel based organic photoconductor drum substrates for use with existing end cap ground seals. End caps are used in the manufacture and handling of drum and belt type photoreceptor articles. In substituting nickel based photoconductor drums in place of aluminum based photoconductor drums two problems are encountered: one is that the nickel wall thickness is less than the aluminum wall substrate which results in relatively larger internal diameter drum which has a loose fit with existing end caps; and a second problem is the deformation of the nickel where the grounding caps come in to contact with the substrate. A solution to the above problems is achieved by providing and installing a sleeve of conductive material such as aluminum, on the end caps and then gluing the nickel substrates onto the sleeve with a conductive glue composition which completes a grounding path. This process enables drum testing and a reduction in the number of drums damaged in the coating and removal process. The improved adaptation process and use of nickel substrates provides a number of cost advantages. The adaptation process may be easily automated and thereby provides additional cost savings.

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XEROX DISCLOSURE JOURNAL

IMPROVED NICKEL SUBSTRATE Proposed Classification PHOTOCONDUCTOR GROUNDING U.S. C1.430/059
OF END CAPS
Gary J. Maier
Steven M. Sterling
Gary A. Batt

Int. C1. G03g 05/06

Disclosed is a method for the adapting nickel based organic photoconductor drum substrates for use with existing end cap ground seals. End caps are used in the manufacture and handling of drum and belt type photoreceptor articles. In substituting nickel based photoconductor drums in place of aluminum based photoconductor drums two problems are encountered: one is that the nickel wall thickness is less than the aluminum wall substrate which results in relatively larger internal diameter drum which has a loose fit with existing end caps; and a second problem is the deformation of the nickel where the grounding caps come in to contact with the substrate. A solution to the above problems is achieved by providing and installing a sleeve of conductive material such as aluminum, on the end caps and then gluing the nickel substrates onto the sleeve with a conductive glue composition which completes a grounding path. This process enables drum testing and a reduction in the number of drums damaged in the coating and removal process. The improved adaptation process and use of nickel substrates provides a number of cost advantages. The adaptation process may be easily automated and thereby provides additional cost savings.

One particular advantage of the above described improved metho...