Browse Prior Art Database

POLYIMIDE FOR HEATER WAFER FABRICATION IN THERMAL INK JET DEVICES

IP.com Disclosure Number: IPCOM000027354D
Original Publication Date: 1996-Jun-30
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 34K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is the use of a polyimide in Thermal Ink Jet printhead fabrication. Typically fluorination is used to render the fiont face of the printhead hydrophobic for better directionality. Using a highly hydrophobic WE-1111 polyimide available fiom E.I. DuPont Co., adjacent channel areas are not fluorinated and remain hydrophilic for optimum jetting.

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XEROX DISCLOSURE JOURNAL

POLYIMIDE FOR HEATER WAFER FABRICATION IN THERMAL INK JET
DEVICES
Daniel E. Khan
Cathie J. Burke

Proposed Classification

U. S. C1.346/140R ht. C1. GO1 d 15/18

Disclosed is the use of a polyimide in Thermal Ink Jet printhead fabrication. Typically fluorination is used to render the fiont face of the printhead hydrophobic for better directionality. Using a highly hydrophobic WE-1111 polyimide available fiom E.I. DuPont Co., adjacent channel areas are not fluorinated and remain hydrophilic for optimum jetting.

XEROX DISCLOSURE JOURNAL - Vol. 2 1, No. 3 May/June 1996 20 1

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202 XEROX DISCLOSURE JOURNAL - Vol. 2 1, No. 3 May/June 1996

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