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ORGANOSILICON POLYMER FOR THERMAL INK JET PRINTHEAD

IP.com Disclosure Number: IPCOM000027428D
Original Publication Date: 1996-Dec-31
Included in the Prior Art Database: 2004-Apr-07
Document File: 2 page(s) / 87K

Publishing Venue

Xerox Disclosure Journal

Abstract

The heater wafer of some Thermal Ink Jet (TIJ) printheads include a polyimide photoresist barrier layer. This polyimide layer has inadequate hydrolytic stability to withstand the organic solvents and the alkaline nature of TIJ ink formulations. Poly(p-methoxybenzylsilsesquioxane) is a double chain or ladder organosilicon polymer that can be cast as a film from solution and then patterned by reactive ion etching using a fluorinated gas such as C2F6, CF4, or SF6 and O, gas and an appropriate mask. Removal of the mask and treatment of the entire surface with an oxygen Reactive Ion Etch (RIE) forms a passivating Si02 layer on the upper surface.

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XEROX DISCLOSURE JOURNAL

ORGANOSILICON POLYMER FOR THERMAL INK JET PRINTHEAD Kathy-Jo Brodsky

Proposed Classification
U. S. C1.347/064 Int. C1. Gold 15/18

The heater wafer of some Thermal Ink Jet (TIJ) printheads include a polyimide photoresist barrier layer. This polyimide layer has inadequate hydrolytic stability to withstand the organic solvents and the alkaline nature of TIJ ink formulations. Poly(p- methoxybenzylsilsesquioxane) is a double chain or ladder organosilicon polymer that can be cast as a film from solution and then patterned by reactive ion etching using a fluorinated gas such as C2F6, CF4, or SF6 and O, gas and an appropriate mask. Removal of the mask and treatment of the entire surface with an oxygen Reactive Ion Etch (RIE) forms a passivating Si02 layer on the upper surface.

Photodefmable patterning mechanisms typically rely on wet chemical (or solvent) development that depend on enhanced or decreased solubility properties. For example, in positive resists, the exposed regions dissolve away preferentially in the solvent. The unexposed region dissolves also, but at a much slower rate. For negative resists, the exposed regions become crosslinked, but typically swell when exposed to solvents that remove the unexposed region. Thus, it would be desirable to have a barrier material that is chemically compatible with current and future ink formulations and that does not rely on a solubility mechanism for development. An alternative "dry" pattern formi...