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Browse Prior Art Database

WIREBOND ENCAPSULATION TO PREVENT BACKFLOW OF INK

IP.com Disclosure Number: IPCOM000027675D
Original Publication Date: 1998-Oct-31
Included in the Prior Art Database: 2004-Apr-08
Document File: 2 page(s) / 109K

Publishing Venue

Xerox Disclosure Journal

Abstract

Individual printhead elements or subunits are butted together and aligned on a supporting substrate to form a Full Width Thermal Ink Jet (FW TIJ) printbar. The aligned printhead elements are fvred to a supporting substrate with epoxy to maintain alignment. The figure

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XEROX DISCLOSURE JOURNAL

WIREBOND ENCAPSULATION TO PREVENT BACKFLOW OF INK Mark A Cellura
Peter J. Nystrom
Jeffrey D. Barner

Proposed Classification
U. S. CL 346/140R Int. CL Gold 15/18

Individual printhead elements or subunits are butted together and aligned on a supporting substrate to form a Full Width Thermal Ink Jet (FW TIJ) printbar. The aligned printhead elements are fvred to a supporting substrate with epoxy to maintain alignment. The figure

XEROX DISCLOSURE JOURNAL - Vol. 23, No. 5 September/October 1998 199

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WIREBOND ENCAPSULATION TO PREVENT BACKFLOW OF INK (CONT'D)

shows a portion of a FW TIJ printbar and a first subunit 1 and a second subunit 2 meeting at an interface 3. Ink is ejected from the nozzles 4 for depositing on a recording medium.

During printing, ink ejected from the nozzles 4 can collect upon the fi-ont face 5 of the FW TLT printbar. Located behind the subunit array and fined to the supporting substrate is a Printed Wiring Board (PWB) containing circuitry and electrical interconnections required to interface and drive individual heating elements (not shown) located in ink channels (not shown) upstream of each nozzle 4 on the front face 5.

Ink which collects on the front face 5 can be pulled by capillary action into gaps formed between the butted subunits back to the electrial interconnections and circuitry located at the PWB where electrical shorting can occur. By using a dielectric wire bond encapsulation material 6 with low viscosity and appropriate surface tension, the encapsulant is pulled by capillary action into the gaps formed between...