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PINHOLE FREE ANODIC COATING WITH NON-IONIC SEALANT FOR ELECTRO-PHOTOGRAPHIC APPLICATIONS

IP.com Disclosure Number: IPCOM000027729D
Original Publication Date: 1999-Feb-28
Included in the Prior Art Database: 2004-Apr-09
Document File: 2 page(s) / 112K

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is the application of a specific type of anodizing that reduces or eliminates pin holes that occur in the normal hard coat anodizing of Hybrid Scavengeless Development (HSD) donor rolls. This specific process is optimized to produce a high dielectric strength material that minimizes the pin hole defect, whereas normal anodizing processes are optimized for wear resistance, corrosion resistances, and deposition rate. The process was reduced to practice when twelve HSD roll substrates were anodized. Following the anodizing, the substrates were hot water sealed in an effort to further reduce the inherent porosity. A hot water was chosen because it is non-ionic. The previous sealant nickel acetate, is a salt. It is possible that under applied voltage, the ionic bond between the acetate and nickel is broken, leaving charge carriers. This may have an influence on the conductivity of the coating. This potential problem would not exist with a hot water seal.

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XEROX DISCLOSURE JOURNAL

PINHOLE FREE ANODIC COATING WITH NON-IONIC SEALANT FOR ELECTRO- PHOTOGRAPHIC APPLICATIONS Michelle L. Schlafer
Ann M. Kazakos
Allen J. Thompson
Heiko Rommelmann
William H. Wayman
Yuan Yu
Bing R. Hsieh
Donald S. Sypula
Alan R. Kuntz

Proposed Classification
U. S. C1. 399/222 Int. C1. G03g 15/06

Disclosed is the application of a specific type of anodizing that reduces or eliminates pin holes that occur in the normal hard coat anodizing of Hybrid Scavengeless Development (HSD) donor rolls. This specific process is optimized to produce a high dielectric strength material that minimizes the pin hole defect, whereas normal anodizing processes are optimized for wear resistance, corrosion resistances, and deposition rate. The process was reduced to practice when twelve HSD roll substrates were anodized. Following the anodizing, the substrates were hot water sealed in an effort to further reduce the inherent porosity. A hot water was chosen because it is non-ionic. The previous sealant nickel acetate, is a salt. It is possible that under applied voltage, the ionic bond between the acetate and nickel is broken, leaving charge carriers. This may have an influence on the conductivity of the coating. This potential problem would not exist with a hot water seal.

The anodized roll substrates were tested for pinholes in a laboratory fvcture. The fvcture consists of a lathe on which the roll spins between its centers while a carbon brush is swept along the roll surface. The leakage current is recorded for a given applied voltage. The voltage is stepped in two increments, a low voltage of 100 volts to search for obvious pin holes, and a higher voltage of 500 volts to search for voids which breakdown into pinholes when higher voltage is applied. The twelve rolls tested did not exhibit pinhole or void defects.

The high dielectric strength processing was developed for the semiconductor industry. The major anodizing process parameters of interest include bath temperature, acid concentration, power source...